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Last modified:
  30 Mar 2009
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Mobile phone components get slimmer

The mobile phone industry's fad for producing the slimmest possible devices is pressuring the components sector to shrink stuff a small as possible. Cottyoning on, Sipex has introduced its first dual-channel LDO (Low Drop Out) regulator, the tiddly SP6265. This new device is ideal for supplying mobile processors with core and I/O voltages, Sipex says. The SP6265 reduces height by offering a 0.6mm ultra-low profile package enabling designers to meet critical height requirements for ultra-slim consumer devices like phones. The company claims the lower profile allows for board space reduction, package efficiency in the z-dimension, and overall system weight reduction. The integrated dual-channel design also reduces the component count by removing the need for two separate devices. Additionally, the SP6265 is available in fixed output options from 1.8V to 3.3V thereby eliminating the need for an external resistor network. Pricing for the SP6265 in a DFN-8 package is $0.75 or $0.70 for a TSOT-23-6 package in quantities of 1,000 units.

The full Inquirer story ... Sipex slims down mobile component offerings

www.sipex.com